Molding die for manufacturing semiconductor device

Abstract

Abstract PURPOSE: To eliminate the need for die matching by forming a recessed section to an abutting surface in one mold in a pair of molds and substantially shaping the abutting surface of the other mold in a plane. CONSTITUTION:Recessed sections 11b, 11c are formed to the abutting surface 11a of a top force 11, no recessed section is shaped to the abutting surface 12a of a bottom force 12, and the abutting surface 12a is formed substantially in a plane 12b. A tablet is charged into a charging port 17, and pushed by a plunger, thus filling the insides of cavities 13, 14 with a resin through a runner and a gate, then sealing semiconductor chips 15 with the resin together with one parts of lead frames 16. The molds 11, 12 are separated, molded forms are removed from a molding die 10, and the lead frames are cut, thus acquiring a semiconductor device 19 having structure in which leads 16a are bent in the direction of the height of a resin package 18 in the resin package 18 and one end sides 16a-1 are exposed to the lower surface of the resin package 18 as terminals and extended to both sides. Accordingly, the die-matching of the top force 11 and the bottom force 12 is unnecessitated substantially.

Inventors

• 👤 Michio Ishihara
• 👤 石原　通男

Bibliographic Details