Metal plating treatment

Abstract

Abstract PURPOSE:To develop a secure anchor effect to a plating layer and to attain high adhesive strength by executing etching by using an etching liquid having a specific compsn. as a pretreatment for a polyphenylene sulfide resin compsn. CONSTITUTION:A chemical etching treatment stage by the etching liquid is executed as part of a metal plating treatment method. A liquid mixture composed of nitric acid and 30-300g (per 1l of the etching liquid) NH4F.HF is used as said etching liquid. A rugged surface having the good adhesiveness to the plating layer is thereby formed on the surface including the surface skin layer of a molding consisting of the polyphenylene sulfide resin compsn. The chemical etching treatment is not enough if the concn. of the NH4F.HF contained therein is <30g and the surface is overetched when the concn. exceeds 300g. The adhesive strength of the metal plating decreases in either case.

Inventors

• 👤 Kiyotaka Kawashima
• 👤 川島　清隆

Bibliographic Details