Plating method

Abstract

Abstract PURPOSE:To stabilize a plating bath without using additives by forming a layer which hardly dissolves at least one kind of the components of a plating liquid except a plating liquid layer and executing plating in the co-presence of the plating liquid layer and the hardly soluble layer for the plating liquid component. CONSTITUTION:The hardly soluble layer 2 for the plating liquid component is formed in the bottom of the plating bath in which particles 3 of, for example, copper, etc., are reserved in such a manner that the additional progression of the plating reaction does not progress to stop the decomposition of the plating bath. The hardly soluble layer 2 is so formulated as not to dissolved the metallic salt or the like which is the essential component of the plating reaction and to isolate the particles 3 of the copper, etc., in the bath bottom from the plating reaction which takes place in the upper part of the bath. The decomposition of the liquid is approximately completely prevented if the plating liquid 4 is stirred by making simultaneous and arbitrary combination use of stirring. As a result, the plating bath is stabilized without using the additives.

Inventors

• 👤 Koji Kondo
• 👤 宏司 近藤
• 👤 Katsuhiko Murakawa
• 👤 邑川　克彦
• 👤 Nobumasa Ishida
• 👤 石田　信正
• 👤 Junji Ishikawa
• 👤 石川　純次

Bibliographic Details