Soldering device

Abstract

Abstract PURPOSE:To provide the title device of good productivity eliminating a vapor leakage and with a low cost by making the vapor surface of the inside of a vapor generating tank lower than the inlet and outlet ports and forming the flow of the air from the inlet and outlet ports to the device center. CONSTITUTION:The surface height of the vapor 20 of the liquid for heating of a vapor generating device is taken at the position lower than an inlet port 21 and outlet port 22 and the conveyor 15 for transfer of the commodity 14 to be soldered is inclined at 2-6 deg.. The air for circulation is blown out of a blowing nozzle 26A and after being sucked from a suction port 26 it is recirculated after being cooled by a cooling condensation recoveror 27. The air therefore forms an air curtain and is recirculated to the center from the right and left, so no vapor is leaked outside and the vapor consumption amount is reduced. Consequently the device having good productivity with low production cost can be formed.

Inventors

• 👤 Susumu Saito
• 👤 進 斉藤
• 👤 Masaru Takahashi
• 👤 賢 高橋
• 👤 Takao Naito
• 👤 孝夫 内藤
• 👤 Yoshihiko Misawa
• 👤 義彦 三沢

Bibliographic Details