Semiconductor package

Abstract

Abstract PURPOSE:To increase pins without scaling up a shape while improving heat- dissipating properties by arranging pins on the surface reverse to a cavity in a ceramic substrate consisting of a predetermined material and radiation fins on the cavity side. CONSTITUTION:Radiation fins 13 are disposed on the side where there is a cavity 12, in which an IC 14 is mounted, in a substrate 15 composed of an aluminum nitride ceramic material having high thermal conductivity and small thermal resistance up to the radiation fins. Pins 11a, 11b... are arranged on the reverse surface of the substrate 15, and the pins can also be fitted to a section corresponding to the cavity 12. According to said constitution, the pins can be increased and heat-dissipating properties are improved without scaling down a shape.

Inventors

• 👤 Nobuo Iwase
• 👤 岩瀬　暢男
• 👤 Toshiro Yanagisawa
• 👤 柳沢　俊郎

Bibliographic Details