Semiconductor sealing resin composition

Abstract

Abstract PURPOSE:To provide the titled resin compsn. which has good moldability, does not damage the surface of a semiconductor, etc. and hardly yields defective goods during the use of a semiconductor sealed therewith, by incorporating a spherical fused silica having the max. particle size of a specified value or below and a specific surface area of a specified value or below. CONSTITUTION:A spherical fused silica having the max. particle size of 20mum or below and a specific surface area of 3m<2>/g or below is prepd., e.g., by a method wherein high-purity siliceous stone, siliceous and, etc., are allowed to fuse together and lump, the lump is ground or crushed into a powder having a particle size of 20mum or below and the powder is flame-sprayed by using flames such as propane/oxygen flames to give a spheroid. 40-90wt% said spheri cal fused silica is kneaded with a resin (e.g., an epoxy resin, a silicone resin) and additives such as a hardener, a parting agent, a flame retarder, etc., in a kneader, a Banbury mixer, etc., to obtain the desired semiconductor sealing resin compsn.

Inventors

• 👤 Tatsuro Iida
• 👤 達郎 飯田
• 👤 Hiroyuki Kuroda
• 👤 黒田　寛之

Bibliographic Details