Formation of very small gold electrode

Abstract

Abstract PURPOSE:To reduce cost by subjecting both face sides of a substrate to photoresist coating, superposing image masks having patterns of electrodes thereon and subjecting the photoresists to exposing and developing, then successively depositing chromium and gold thereon by evaporation. CONSTITUTION:Both side faces of the glass substrate or the like is subjected to coating of the positive type or negative type photoresist respectively and after the photoresists are prebaked, for about 5-60min at about 70-100 deg.C, positive masks or negative masks having the patterns of the electrodes are superposed thereon and are subjected to contact exposure for about 10-120sec by a mask aligner. The photoresists are developed by using a developing soln. for the photoresist and after rinsing, the chromium and gold are successively deposited by evaporation on the cured resin parts. The vapor deposition is executed in both cases by a vapor deposition method, sputtering method, etc., and the thicknesses thereof are made about 500-1,000Angstrom of the chromium layer and about 1,000-3,000Angstrom of the gold layer. The very small gold electrodes are thus easily formed on both side faces of the glass substrate by which the cost is reduced.

Inventors

• 👤 Masao Goto
• 👤 正男 後藤
• 👤 Ichiro Takatsu
• 👤 高津　一郎

Bibliographic Details