Semiconductor device

Abstract

Abstract PURPOSE:To miniaturize a semiconductor device restricting thermal stress on a semiconductor chip to minimum by a method wherein the semiconductor chip is fixed to a thermal stress cushioning member made of molybdenum sheet through the intermediary of a silicon base insulating sheet. CONSTITUTION:Molybdenum sheet 2 is fixed by silver brazing process 3 on the surface of heat sink 1 made of metallic base such as copper etc. and then a silicon base insulating sheet (silicon carbide) 5 both sides of which are preliminarily plated with nickel 4 is welded into the surface of molybdenum sheet 2 by high temperature soldering process. Besides, a semiconductor ship 7 is likewise welding into said insulating sheet 5 by high temperature soldering process 8. In such a constitution, the molybdenum sheet 2 is firmly fixed to the metallic base (copper) 1 having a large thermal expansion coefficient difference by silver brazing process to be formed into a structure that can withstands thermal stress.

Inventors

• 👤 Noboru Sugiura
• 👤 登 杉浦
• 👤 Hideyuki Ouchi
• 👤 秀之 大内
• 👤 Yasuo Noto
• 👤 康雄 能登
• 👤 Tomiro Yasuda
• 👤 安田　富郎

Bibliographic Details