Semiconductor integrated circuit device

Abstract

Abstract PURPOSE:To increase functions, and to augment the mounting density by connecting the surface of a first pellet and the surface of a second pellet to the same lead frame while being oppositely faced. CONSTITUTION:A lead frame 1 connects electrode sections 3 and 6 for pellets 2 and 5 through metals 4 and 7. Consequently, the two pellets are introduced into one plastic package without using two plastic packages by employing two surfaces as compared to a conventional technique through which only one surface is used, thus increasing functions. That is, memory capacity can be doubled by employing pellets for a RAM as the pellets of the pellets 2, 5. The pellets for the RAM are used as the pellet 2 or 5, and pellets for a ROM are employed as the pellet 5 or 2, thus giving the functions of the RAM and the ROM by one plastic package.

Inventors

• 👤 Noboru Itomi
• 👤 登 井富

Bibliographic Details