Package for integrated circuit

Abstract

Abstract PURPOSE:To improve the wirings of a signal by providing a plurality of pads at an arbitrary positions of one external connecting terminal, and a plurality of inner terminals connected with one external connecting terminal to wire bond with the pads. CONSTITUTION:Integrated circuit chips 5 placed on a chip placing unit of an integrated circuit package 1 for a sole power source (VCC) with 32 pins are distributed on four sides, only two types of VCC and GND have a plurality of electrodes, inner terminals 2, 2,... of the package 1 corresponding thereto are alternately disposed at the inner terminals of VCC, GND at every two pieces, and the inner terminals are connected with the pads 6 on the chip by bonding wirings 7. Thus, a signal used in an integrated circuit chip can be wire bonded to necessary position.

Inventors

• 👤 Masami Hayakawa
• 👤 早川　正美

Bibliographic Details