Manufacture of pressure sensor

Abstract

Abstract PURPOSE:To elevate the yields of a product with a simple construction, by arranging a process for heat bonding base wafers, a process for cutting them into pressure sensor elements and a heat treatment process for heating the work above the glass transition point. CONSTITUTION:An element wafer 10 has a plurality of pressure sensor elements 11, which each have a diaphragm section 12 sufficiently thin T2 compared with the thickness T1 of a base material and a piezo-resistance element 15 is formed on the upper side thereof. A base wafer 20 has through holes 22 at the positions corresponding to the respective diaphragm sections 12. The wafers 10 and 20 are laminated with a low melting point glass 30 composed of B2O3 and PbO or the like. Thereafter,the wafers 10 and 20 are set in a furnace to be heated and cooled. As a result, the glass 30 melts to bond the wafers 10 and 20 together. After the bonding by heat, the work is cut into separate pressure sensors with a diamond cutter along the cutting surface. The pressure sensors thus obtained re placed into a heating furnace and undergoes a thermal treatment for heating and cooling.

Inventors

• 👤 Toshimasa Miyata
• 👤 宮田　敏正
• 👤 Tomiki Sakurai
• 👤 桜井　止水城
• 👤 Masayuki Ibe
• 👤 井辺　雅之

Bibliographic Details