Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To prevent a semiconductor substrate from being broken during the process for separating the substrate into chips, by carrying out the blade dicing process and the lapping process in a reverse order for the purpose of omitting the process for peeling a protection tape directly from the substrate. CONSTITUTION:The surface 11a of a substrate 11 on which elements have been produced completely is cut along predetermined lines to provide grooves 12 (blade dicing process). A protection tape 13 is adhered onto the surface of the substrate 11 so that the tape 13 also prevents the scattering of chips. Subsequently the rear face of the substrate is polished up to the vicinity of the grooves 12 (lapping process). A pressure is applied to the rear surface of the substrate 11 by means of a rubber roller or the like so as to separate the substrate into chips 14 by the grooves 12. Finally, the protection tape 13 is peeled off from the surface 14a of each chip 14.

Inventors

• 👤 Akio Washio
• 👤 鷲尾　昭雄

Bibliographic Details