Checking system with wafer prober

Abstract

Abstract PURPOSE:To shorten the working process by a method wherein, after the first tests are performed by the first placing means, a wafer is transferred to the second placing means and the second tests are performed. CONSTITUTION:A wafer, which is transported from a wafer cassette input means 7 by way of an automatic alignment means 5, is attracted onto a placing table of the first placing means 1 and electrical characteristics of respective chips are tested. After the tests on the wafer by the means 1 are completed, the wafer is transferred onto the placing table of the second placing means 2 by a transfer means 6 and the other electrical characteristics which can not be tested by the means 1 are tested. When the wafer is subjected to the tests, electrode pads on the respective chips and measuring cables of a tester A and a tester B are brought into contact with each other by contact means 3 and 4.

Inventors

• 👤 Keiichi Yokota
• 👤 横田　敬一

Bibliographic Details