Piercing method for printed board

Abstract

Abstract PURPOSE:To perform a piercing without any displacement for a wiring pattern by forming a wiring pattern on a printed board, by detecting the shape and size of the wiring pattern part where a through hole is to be made and by deciding the position to be pierced. CONSTITUTION:Wiring patterns 2A, 3A and 2B, 3B, etc. are formed on a printed board 1 prior to piercing a through hole 4 on the printed board 1. The shape and size of the wiring pattern part 3A where the through hole 4 is to be pierced on the printed board 1 are detected by a wiring pattern image pickup device. Based on this detected result, the position to be pierced is decided and the piercing is performed by the laser beam, etc. on this decided position. The piercing of the through hole can thus be performed without any displacement for the wiring pattern.

Inventors

• 👤 Tatsuo Hakuta
• 👤 伯田　達夫
• 👤 Mitsutoshi Numata
• 👤 沼田　允利

Bibliographic Details