Lead frame

Abstract

Abstract PURPOSE:To improve electric characteristics, by providing a secondary lead, performing wire connection between specified electrode parts of a semiconductor chip and inner leads, between the inner leads, thereby preventing the deformation of metal wire due to injecting pressure of a molding resin. CONSTITUTION:A secondary lead for wire connection between specified electrode parts of a semiconductor chip 6 and inner leads 7 is provided between the inner leads 7. Long metal wire 8, which is connected to the specified electrode of the chip 6 from the inner lead 7, is once relayed by the secondary lead 3. Then, the length of the wire 8 becomes short, and the deformation of the wire 8 due to the injecting pressure of a molding resin can be prevented. Thus, the electric characteristics can be improved.

Inventors

• 👤 Koji Nose
• 👤 幸之 野世

Bibliographic Details