Contact type image sensor
Abstract
Abstract PURPOSE:To simplify the processing at the junction between chips and obtain a large scale sensor easily by a method wherein a sensor array in which the first sensor is a dummy and a scanning circuit are provided in a sensor chip and (n) such sensor chips are mounted on one substrate and (n-1) data ratchets are employed. CONSTITUTION:Image sensor chips S1-S3 in which sensor arrays composed of photodiodes D1-D99 are provided are mounted linearly on a mounting substrate. The first sensors in the respective chips are dummies and the chips S1-S3 are mounted in such a manner that the sensors D2-D99 of the respective chips are arranged with uniform intervals through all chips S1-S3. The chips are connected in cascade by connecting video output terminals VID and connecting an ending pulse terminal EP and a starting pulse terminal SP of the adjacent chips. The video outputs from the chips S1-S3 are successively stored in data ratchets R1 and R2 through a pre-amplifier 407, an A/D converter 401 and so forth. A data selector 402 selects the output of the (i)th chips Si from the (n-1)th ratchet R(n-i) or the converter 401 and outputs it as a continuous data 404.
Inventors
- 👤 Yoshio Nakazawa
- 👤 良雄 中澤
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.