Thermally curable resin composition

Abstract

Abstract PURPOSE:The titled composition providing a cured material having improved toughness, flexibility, adhesiveness, heat resistance and solubility, obtained by blending a polyimide shown by a specific structure with a specific polymaleimide. CONSTITUTION:(A) A polyimide shown by the formula I(Ar is bifunctional group having a molar ratio of group shown by the formula II to group shown by the formula III of 100:0-10:90) is blended with (B) a polymaleimide [e.g., N,N'-(4,4'-diphenylmethane) bismaleimide, etc.,] shown by the formula IV(R is group of >=2 integer valence; n is =2) in a ratio of the component A:B=90:10-50:50, to give the aimed composition.

Inventors

• 👤 Shuichi Matsuura
• 👤 秀一 松浦
• 👤 Yasuo Miyadera
• 👤 康夫 宮寺
• 👤 Toshihiko Kato
• 👤 利彦 加藤

Bibliographic Details