Forming method for bump

Abstract

Abstract PURPOSE:To form a bump consisting of the spherical ball of gold onto an IC chip electrode by pushing and fast sticking a ball shaped at the tip section of a gold wire onto the electrode for external connection for an IC chip and pulling up the gold wire. CONSTITUTION:An IC chip 4 to which a bump must be formed is fixed 7 temporarily onto a support plate 6. A capillary tool 14 for a thermosonic-ball-bonding device is faced oppositely to an electrode 13 for the IC chip 4 temporarily fixed onto the support plate 6. A gold wire 16 is set to the capillary tool 14, and ball 15 is shaped at the tip of the gold wire 16 by an electric torch, and lowered together with the capillary tool 14. Consequently, the ball 15 is contact- bonded onto the electrode 13. When the capillary tool 14 is elevated, the ball 15 section is left on the IC chip electrode 13, but the ball 15 section functions as a bump 8.

Inventors

• 👤 Hisashi Oguro
• 👤 小黒　寿

Bibliographic Details