Semiconductor device

Abstract

Abstract PURPOSE:To prevent solder from depositing thick on the surface of a lower stage semiconductor device external terminal especially on its electrode receptacle by a method wherein the width is made small in the package side portion than in the external terminal bend. CONSTITUTION:A proximity section 2b that is an external terminal between a bend 6 and package 7 is smaller in width than a wide section 2a located exterior to the bend 6. Therefore, even in case of molten solder trapped in the proximity section 2b, the strength wherewith the proximity section 2b holds the molten solder, considered dependent upon the size of the wet area and the surface tension of the molten solder in the vicinity of the proximity section 2b, is smaller. It follows that after the dipping in molten solder of the lower stage semiconductor device, wherein the entirety of an external terminal 2 is bathed in the molten solder, the molten solder on the surface of the external terminal 2 rapidly flows down. Accordingly, an unnecessary solder bead 8, as indicated by a broken line in the figure, will not be allowed to stay on the surface of the external terminal 2.

Inventors

• 👤 Naotake Genmoto
• 👤 元本　直武
• 👤 Tadashi Takahashi
• 👤 忠 高橋

Bibliographic Details