Ion plating device

Abstract

Abstract PURPOSE:To form a thin film having high quality, large adhesive power and good quality by providing plural evaporating sources in a vacuum vessel and providing one unit each of high-frequency coils to a prescribed number of the evaporating sources. CONSTITUTION:The plural evaporating sources 2 are provided in the vacuum vessel 1 of an ion plating device and one unit per 2-3 units of the evaporating sources 2 of the high-frquency coils 4A, 4B are commonly used. Evaporating materials 3 are evaporated from the evaporating sources 3 and are ionized by the high-frequency coils 4A, 4B. The ions are accelerated by an electric field so as to collide against and stick to the substrate 7. The number of the coils 4A, 4B to be installed is thereby considerably decreased and the interference of the coils 4A, 4B with each other is decreased.

Inventors

• 👤 Takao Mitsui
• 👤 三井　隆男
• 👤 Hiroshi Sugimura
• 👤 寛 杉村
• 👤 Shinji Houchiyou
• 👤 伸次 庖丁
• 👤 Minoru Yamamoto
• 👤 稔 山元
• 👤 Tatsuhiko Shimizu
• 👤 達彦 清水

Bibliographic Details