Dispersion strengthening heat resistant copper alloy material

Abstract

Abstract PURPOSE:To provide superior alloy strength, high electric conductivity and high thermal diffusivity by dispersing hard particles of an intermetallic compound having a specified particle size and ceramic particles having a specified particle size in a Cu matrix. CONSTITUTION:Hard particles of an intermetallic compound such as Cu-Fe having <=1mum particle size and particles of ceramics such as TaC, TiCN, B4C, Al2O3 or TiB2 having <=1,000Angstrom average particle size are dispersed in a Cu matrix to obtain a dispersion strengthening heat resistant Cu alloy material. This dispersion stengthening alloy material is produced by applying mechanical alloying technique. The alloy material has superior characteristics of both of conventional precipitation hardening and dispersion hardening alloys and can be utilized as a material for an electrode, electronic parts, etc.

Inventors

• 👤 Shigeki Ochi
• 👤 越智　茂樹
• 👤 Atsushi Kuroishi
• 👤 黒石　農士

Bibliographic Details