Capillary for wire bonding

Abstract

Abstract PURPOSE:To improve wear-resistance, hardness, and corrosion-resistance of a capillary pointed end part, by putting a hard thin film at least on a surface of the pointed end part of the capillary formed of ceramics or thermit for wire bonding. CONSTITUTION:A capillary 1 is formed of ceramics, provided with an small hole 1a for drawing out a conductor at its pointed end, with its surface of the pointed end part covered with a hard thin film 2. Because the hard thin film 2 is formed over the inside surface of the small hole 1a to become a smooth plane, the conductor can be smoothly drawn out, preventing chemical reaction between the capillary 1 and the conductor. And, the life of the capillary 1 can be also increased because of its enhanced hardness and wear-resistance. TiC, TiN, SiC, Si3N4, diamond, Al2O3, AlN, TiB2, B4C, BN, BP, and the like are used as hard thin film.

Inventors

• 👤 Hiroyuki Miura
• 👤 宏之 三浦
• 👤 Hiroshi Aida
• 👤 比呂史 会田
• 👤 Koichi Yamaguchi
• 👤 浩一 山口

Bibliographic Details