Semiconductor device and manufacture thereof

Abstract

Abstract PURPOSE:To improve the moisture resistance of a bonding pad of a semiconductor device by providing an inactive film of a pad member covered on the exposed surface of the pad except a bonding connecting region of an external lead fine conductor. CONSTITUTION:A semiconductor substrate 1, an insulator protecting film 2, a bonding pad 3, an external lead fine conductor 4, and an alumina inactive film 5 formed to cover the exposed surface of the pad 3 are provided. The film 5 is formed by the following sequence. After the conductor 4 is bonded, it is dipped in hydrogen peroxide solution at 10-30 deg.C of 20-35wt% of density for 5-10min or immersed in conc. nitric acid solution of 60-70% of density at the same temperature for several seconds. This film quality is dense, waterproof, acid resistance, thermal resistance to be extremely chemically stable to act so that the film substantially exists on the exposed surface of the pad 3, thereby remarkably improving the moisture resistance of the pad 3.

Inventors

• 👤 Takehiko Kubota
• 👤 久保田　武彦
• 👤 Yutaka Tomita
• 👤 豊 冨田

Bibliographic Details