Lead frame

Abstract

Abstract PURPOSE:To make it possible to securely regulate the dimension of plating at both side surfaces of a lead section by providing a connecting rod connecting each lead section near the area where the plating is to be done so as to prevent plating liquid from flowing to the region where the plating is not required. CONSTITUTION:A connecting rod 5 connecting each lead section 3 is formed adjacent to the outside of a boundary line 4 of plating area. When the plating area surrounded by the plating area boundary line 4 is sprayed with plating liquid, a mounting table 2 within the plating area and the surface of a top section 30 of the lead are plated. At that time, the plating solution 8 is also applied on the lead section side surface 31 at the top 30 of the lead and is about to gradually diffuse. However, the diffusion is stopped with the provided connecting rod when the plating solution 8 adhered on the side surface 31 of the lead section reaches the connecting rod 5.

Inventors

• 👤 Tatsuya Otaka
• 👤 達也 大高
• 👤 Hiromichi Yoshida
• 👤 博通 吉田
• 👤 Takashi Suzumura
• 👤 隆志 鈴村

Bibliographic Details