Wafer etching device

Abstract

Abstract PURPOSE:To contrive to improve the finished accuracy and yield by uniform etching of each part of a wafer by a method wherein the titled device has a wafer-holding means consisting of a holder with grooves that hold part of wafers so as to roll wafers and a drive mechanism which supports the holder to roll wears and move it. CONSTITUTION:The wafer W holding means 10 has a holder 11 that holds many wafers W. The holder 11 is provided with many parallel grooves 12 slightly wider than the wafer thickness. Wafers can be held by the holder through contact of peripheral surfaces on the bottom wall and contact of both surfaces on guides 16 that form the grooves 12, and then through insertion into the grooves, and can be rolled along the grooves in the holder. This holder can be contained in an etching path 20 and can be pivoted on the axis of a shaft 21. The part of a shaft 22 projecting out of the etching bath is connected to a motor situated outside the etching bath via suitable deccelerator, and the holder can be reciprocated and rotated around the shaft 22 by the rotation of the shaft 22 by this motor.

Inventors

• 👤 Kunihiko Murakami
• 👤 邦彦 村上

Bibliographic Details