Leadframe for semiconductor device

Abstract

Abstract PURPOSE:To increase adhesion between resin and leads and to minimize the infiltration of impure objects from outside by a method wherein a step is provided in a tab section between a leadframe framework and pellet-mounting section. CONSTITUTION:A copper alloy sheet is subjected to punch-pressing whereby a leadframe 1 is built wherein leads 2 to be led out, a pellet-mounting section 4, and a tab section 5 are connected to each other. At a joint between the pellet-mounting section 4 and tab section 5, a corrugated step 7 is formed, which is accomplished either simultaneously with said punch-pressing process or in another similar process following said punch-pressing process. This increase the distance between the interface with a resin 6 and the semiconductor pellet, stopping impure objects from invading through the tab 5. By this design, a high-reliability semiconductor device leadframe is obtained.

Inventors

• 👤 Koji Kuwabara
• 👤 浩二 桑原

Bibliographic Details