JPS6180846A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Hitachi Ltd
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Filing: 1984-09-28
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Granted: —
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Expires: 2004-09-28
Abstract
Abstract PURPOSE:To produce a microcomputer capable to increase memory capacity in one LSI package by means of mounting a memory chip on a microcomputer chip. CONSTITUTION:A microcomputer chip is mounted on the mounting plane alphaof an LSI package 5. The microcomputer chip 1 is provided with a bonding pad 2 to be connected to a pin of the LSI package 5 as well as bumps 3 to be connected to a memory chip 4. This microcomputer chip 1 is connected to the memory chip 4 also provided with bumps 3. Through these procedures, one LSI package may be provided with the microcomputer chip and the memory chip.
Inventors
- 👤 Yoshiaki Yamashita
- 👤 山下 慶晃
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-01 05:42
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/722
Claims Analysis
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