Semiconductor device

Abstract

Abstract PURPOSE:To remove a stepped section in a bonding pad and to improve reliability by forming through-holes in the outer circumferential section of the bonding pad. CONSTITUTION:First Al electrodes 14 are connected to a second Al electrode 16 by through-holes in an inter-layer insulating flm 15 shaped to the outer circumferential section of a pad, and the electrode 16 is bonded by an Au wire 17. According to the structure, a stepped section is hardly formed just under the wire bonding, and the inter-layer insulating film 15 is not broken by the pressure of the wire bonding on wire bonding, thus obtaining a semiconductor device having high reliability.

Inventors

• 👤 Yukio Tomita
• 👤 富田　行雄

Bibliographic Details