Semiconductor device

Abstract

Abstract PURPOSE:To enable to improve the adhesive strength between the sealing medium and the inner part of the lead and the mechanical strength of the lead by a method wherein one piece or plural pieces of a hole or holes, a notch or notches or a penetrating hole or penetrating holes for lead fixation is/are provided in the inner part and the diameter thereof on the side of the bottom part of each hole or each penetrating hole for lead fixation is formed smaller than the diameter of the surface area of the hole or the penetrating hole. CONSTITUTION:The diameter phiB of the bottom part of a hole 11 for lead fixation provided in the surface or back surface of the inner part 10 of the lead is made smaller than the diameter phiA of the hole 11 on the side of the surface or back surface. Moreover, the diameter phiB of the bottom part of a penetrating hole 12 for lead fixation formed from both of the surface and back surface of the inner part 10 of the lead is made smaller than the diameter ALPHA of the hole 12 on the side of the surface of back surface. When the holes 11 are provided in the surface and back surface of the inner part 10 of the lead, the sealing medium flows in the holes 11 and the parts of the holes 11 are cured. As a result, the adhesive strength between the sealing medium and the inner part 10 of the lead and the mechanical strength of the lead are augmented. Moreover, when the holes 11 and the penetrating holes 12 are provided in combination with each other, the adhesive strength can be enhanced markedly.

Inventors

• 👤 Masachika Masuda
• 👤 正親 増田
• 👤 Akira Suzuki
• 👤 明 鈴木

Bibliographic Details