Lead frame

Abstract

Abstract PURPOSE:To prevent a short circuit by an assembly process of adjacent leads by separably connecting a main lead and several lead partially by a connecting section. CONSTITUTION:A main lead 21 as a semiconductor element placing section and separate lead 22 as metallic small-gage wire connecting sections are connected partially by connecting sections 51. The adjacent leads 22 on the independent terminal side and a plurality of two or more of the leads may be connected by the same sections. According to the lead frame, the leads adjoining at intervals of 0.2-0.3mm. are not short-circuited by assembly processes up to wire bonding, the disconnection of metallic small-gage wires on a wire bonding process can be prevented. Consequently, yield on the assembly processes is improved largely.

Inventors

• 👤 Shizuo Tsuru
• 👤 鶴　静夫
• 👤 Kazufumi Isomichi
• 👤 磯道　一文
• 👤 Takashi Nishimoto
• 👤 西元　貴志
• 👤 Shuichi Kitano
• 👤 修一 北野

Bibliographic Details