Package for multi-chip

Abstract

Abstract PURPOSE:To change wirings for a hybrid IC easily by dividing its midway of a pattern wiring buried and wired into a substrate and each forming bonding pads at the tip sections of buried wirings on both sides of the dividing point. CONSTITUTION:One tip of a buried wiring 11 is connected to an I/O lead 13 through an I/O pad 12. A chip part 17 is fixed onto a die pad 15 shaped onto the surface of a ceramic multilayer substrate 10. The wiring 11 is divided at a position inner than a seal ring pattern 18 to form a non-conductive section 21. Wirings 11a and 11b on both sides of the non-conductive section 21 are connected severally to bonding pads 22a, 22b arranged onto the substrate 10. The wiring 11b is connected to a bonding pad 23. Both the pad 23 and a terminal for the part 17 and both the pads 22a, 22b are bonded respectively by bonding wires 24, 25. According to such constitution, the bonding wire 24 between pads 23a, 22b is removed, and the connections of the pad 22b and other bonding pads can be changed easily.

Inventors

• 👤 Yoshitaka Fukuoka
• 👤 義孝 福岡

Bibliographic Details