Manufacture of ic card

Abstract

Abstract PURPOSE:To connect terminals of an IC chip and to form a circuit network by printing by forming a sheet base material itself into a wiring board,and mounting the IC chip in the board in a buried state. CONSTITUTION:A vinyl chloride resin sheet 1 which is about 0.45mm thick and has an opening part 2 about 100mum larger than the longitudinal and lateral size of the IC chip 5 is backed with a vinyl chloride resin sheet which is about 0.1mm thick. The IC chip 5 is stored in the opening part 2 with a bonding pad part 6 up, and both vinyl sheets 1 and 3 are deformed plastically to obtain the sheet base material 7. Silver paste as conductive paste is printed on the base material 7 to form conductive patterns 8 and 9. Then, cover sheets of vinyl resin having a designed print are heat-pressed and melt-stuck on the top and reverse surfaces of the base material 7 to form an IC card which is 0.76mm thickness.

Inventors

• 👤 Masayuki Ouchi
• 👤 正之 大内
• 👤 Hiroshi Ohira
• 👤 洋 大平
• 👤 Tamio Saito
• 👤 斎藤　民雄
• 👤 Yoshikatsu Fukumoto
• 👤 福本　好克
• 👤 Shuji Hiranuma
• 👤 平沼　修二

Bibliographic Details