Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To make it feasible to check any dispersion of characteristics while making measurement easier by a method wherein a substrate formed of multiple semiconductors with beam lead electrodes is fixed on an insulating sheet utilizing an insulating material to be removed after completion of measurement. CONSTITUTION:One main surface side of substrate 1 formed of multiple beam lead type diodes is coated with an insulating material 8 while the other main surface side of substrate 1l is bonded on a transparent glass substrate 10 as an insulating sheet formed to a beam lead patterns 9. Next the substrate 1 is fixed on the other substrate 10 by baking process and then the beam lead type diodes 9 are separated from the substrate 1 by selective etching process from backside of the substrate 1. Then the characteristics are measured by a measuring device 11. Finally the insulating material 8 is removed to separate the beam lead type diodes from the substrate 10.

Inventors

• 👤 Yasoo Harada
• 👤 原田　八十雄
• 👤 Keiichi Honda
• 👤 本多　圭一
• 👤 Shigeyuki Murai
• 👤 成行 村井

Bibliographic Details