Terminal electrode for superconducting integrated circuit and manufacture thereof

Abstract

Abstract PURPOSE:To manufacture electrode structure displaying superconducting characteristics of contact resistance of zero with excellent reproducibility by stably forming a foundation metallic film for a projecting electrode for external connection in a superconducting LSI. CONSTITUTION:The Nb surface of a terminal 4 for a projecting electrode is etched through sputtering under the decompression of Ar gas at 10<-3>Torr, Nb 17 is deposited in 50nm and Ti 18 in 50nm through a high-speed sputtering method, and an alloy film consisting of Nb-Ti is shaped through heating and diffusion treatment for 30min at 250 deg.C. Au 19 is evaporated in thickness of 100nm. A desired pattern form is obtained through dry etching by using Ar ions. The Nb-Ti alloy film acquires sufficient adhesive properties with Nb in a terminal electrode for external connection in a superconducting LSI even on film formation at a low temperature, and displays stable superconducting characteristics at a cryogenic temperature.

Inventors

• 👤 Mikio Hirano
• 👤 幹夫 平野
• 👤 Hideaki Nakane
• 👤 中根　英章
• 👤 Shinichiro Yano
• 👤 振一郎 矢野
• 👤 Nobuo Miyamoto
• 👤 信雄 宮本

Bibliographic Details