Silver plated conductor

Abstract

Abstract PURPOSE:To improve soldering property by a method wherein, when lead wire for electric part or lead frame is produced, a glossy copper plated layer at least 0.5mum thick is provided on overall surface of a conductor 1 made of copper alloy to be coated with a silver plated layer. CONSTITUTION:A glossy copper plated layer 2 at least 0.5mum thick is provided on overall surface of a conductor 1 made of copper alloy to be coated with a silver plated layer 3. The purpose of glossy copper plated layer 2 is to avoid any defect in the conductor 1 as the base metal as well as to make the crystal of silver plated layer 3 coated thereon fine and even. As for the glossy copper plated layer 2, copper sulfate bath,copper cyanide bath and copper pyro phosphoric acid bath are applicable including any other processes making fine crystalline even and smooth plating feasible. Through these procedures, soldering property may be improved preventing any oxide film from being formed on the interface between copper and silver even after heat treatment.

Inventors

• 👤 Norio Okabe
• 👤 則夫 岡部
• 👤 Osamu Yoshioka
• 👤 修 吉岡
• 👤 Ryozo Yamagishi
• 👤 山岸　良三
• 👤 Sadao Nagayama
• 👤 長山　定夫

Bibliographic Details