Photosensitive resin composition

Abstract

Abstract PURPOSE:To improve the photosensitivity of a photosensitive resin composition and to increase the thermal shock resistance by using half-ester obtd. by converting part of epoxy in a novolak type epoxy compound into acrylate as a base material. CONSTITUTION:A photosensitive resin composition is prepd. by blending 21.2wt% phenol novolak half-ester as a base material with 10.6wt% trimethylolpropane triacrylate as a diluent, 14.7wt% polyester diacrylate and 18.4wt% hydroxyethyl acrylate. To the resin composition are added 1.8wt% mixture consisting of bismethacryloxyethyl phosphate and methacryloxyethyl phosphate for improving the adhesive property to copper foil, 2.4wt% photosetting accelerator, 0.2wt% colorant and 30.7wt% talc as a filler.

Inventors

• 👤 Hajime Tokumitsu
• 👤 徳光　始
• 👤 Yuji Ikegami
• 👤 池神　雄司
• 👤 Kenji Osawa
• 👤 健治 大沢

Bibliographic Details