Semiconductor device

Abstract

Abstract PURPOSE:To obtain a semiconductor device having high reliability placed with a large pellet by mounting the pellet through an elastic material on a pellet mount, and absorbing a stress produced at the pellet by the material. CONSTITUTION:A silicone rubber 8 of an elastic material is used to mount a pellet 2 on a tab 1. In other words, the rubber 8 having adhesive performance and heat resistance of elastic material is used to bond the pellet 2 to the tab 1 to mount the pellet 2. Thus, even if a semiconductor device is affected by the variation in the temperature due to temperature cycle, the difference of thermal expansion coefficients between the pellet 2 of silicon and the like and the tab 1 of ''Kovar'' and the like adsorbed by the rubber 8 is absorbed by the rubber 8. Thus, the stress produced at the pellet 2 due to the difference can be reduced.

Inventors

• 👤 Yutaka Iwata
• 👤 豊 岩田
• 👤 Yoshiaki Wakashima
• 👤 若島　喜昭
• 👤 Kunihiro Tsubosaki
• 👤 邦宏 坪崎

Bibliographic Details