Semiconductor device

Abstract

Abstract PURPOSE:To prevent the infiltration of atmospheric gas and water from outside along the sealed surface of a lead by a method wherein the lead, having the sealed surface where recesses and projections are formed in longitudinal direction of the lead, is provided. CONSTITUTION:The expected regions of wire bonding 1a and 11a having the flat-surface leads 1 and 11, and regions 1b and 11b having the surface of recesses and projections in the longitudinal direction of the leads are provided on the titled semiconductor device. The surfaces of said expected regions are flattened by coining, and this facilitates the bonding of a bonding wire with which the electrode of a semiconductor element is led out. Besides, the sealing part adjoining to the above in the region where recesses and protrusions are formed, and the crest 2a of a groove 2 or a valley 2b or a recessed part hole 3 is provided in this region at right angle to the longitudinal direction of the lead.

Inventors

• 👤 Yuichi Yuki
• 👤 幸　友一

Bibliographic Details