Package for multichip integrated circuit

Abstract

Abstract PURPOSE:To improve heat-dissipating characteristics by fixing a plurality of radiator plates to a plurality of integrated circuit chips loaded onto a substrate through thermal conductive adhesives and setting the radiator plates to a heat- dissipating cover fastened to a heat sink by thermal conductive adhesives. CONSTITUTION:A plurality of TAB type IC chips 2 are connected to a substrate 1 on which input-output terminals 8 are brazed. The chips 2 are bonded with radiator plates 9 by chip adhesives 10. The radiator plates 9 are bonded with the inner surface of a heat-dissipating cover 4 by thermal conductive adhesives 3. A heat sink 5 with fins is fixed to the heat-dissipating cover 4, and structure in which the cover 4 can be cooled by forcibly feeding air among the fins is formed. According to such structure, heat generated from the chips 2 is transmitted effectively over the heat sink 5, thus resulting in effective cooling.

Inventors

• 👤 Toshihiko Watari
• 👤 渡里　俊彦

Bibliographic Details