Manufacture of ic card

Abstract

Abstract PURPOSE:To prevent an IC chip from being broken by static electricity by providing a common electrode to which plural lead-out lines are connected in common at an outer part of an organic sheet, and disconnecting the lead-out lines and common electrode after a press process. CONSTITUTION:A wiring board 14 which mounts an IC chip 11 and has a wiring pattern 12 and an input/output terminal 13 formed is formed projecting partially from organic sheets 15 and 16 as shown by 14a. Then, the lead-out lines 17 each connected to the input/output terminal 13 at one terminal and the common electrode 18 connected to the other-terminal sides of the lead-out lines 17 in common are formed on the projection part 14a of the wiring board 14. An opening 15a is formed in one prganic material sheet 15 opposite the input/output terminal 13. The projection part 14a of the wiring board 14 is cut together with the lead-out lines 17 after the press process to disconnect the lead-out line 17 and common electrode 18.

Inventors

• 👤 Tamio Saito
• 👤 斎藤　民雄
• 👤 Yoshikatsu Fukumoto
• 👤 福本　好克
• 👤 Shuji Hiranuma
• 👤 平沼　修二
• 👤 Hiroshi Ohira
• 👤 洋 大平
• 👤 Masayuki Ouchi
• 👤 正之 大内

Bibliographic Details