Semiconductor device

Abstract

Abstract PURPOSE:To obtain a semiconductor device, distances among wirings thereof are shortened, the positions of connection thereof are reduced and which has high reliability, by laminating semiconductor elements, in which film leads with holes or notches are connected to electrodes, and mutually connecting the holes or the notches in the thickness direction. CONSTITUTION:Holes 6 are formed near the terminal sections of semiconductor elements in film lead groups 3,3',4,4',5 joined with electrodes 2,2' for the semiconductor elements 1,1'. The semiconductor element such as one 1' is placed as the lower layer of the semiconductor element such as one 1, and the hole 6 of a film lead 3 for the semiconductor element 1 and the hole 6' of a film lead 3' for the semiconductor element 1' are penetrated by a conductive material 7, and fixed by soldering 8,8'. The positions of connection are reduced through such connection. The flat area of a mounting body is made merely slightly larger than the size of the semiconductor element, the thickness direction is also limited by the thickness of the semiconductor elements, the mounting body is thinned and miniaturized, distances among wirings are also shortened and reliability is improved. It is preferable that insulators and heat-dissipating materials are inserted among the semiconductor elements.

Inventors

• 👤 Kenzo Hatada
• 👤 畑田　賢造

Bibliographic Details