Flattening method of irregular surface substrate

Abstract

Abstract PURPOSE:To flatten at irregular surface substrate without strain with heat resistance and good reliability by forming a silicone resin of general formula I on the substrate, and thermally fusing the resin. CONSTITUTION:A silicon resin having approx. 40,000 or larger of means molecular weight represented by general formula I, where R is CH3, C(CH3), C2H5 or C6H5 is formed on an irregular surface substrate, and the resin is thermally fused. In order to prepare the flowing temperature of the resin to 300-400 deg.C with mean molecular weight of 25,000-50,000, the resin is thermoset at 350- 400 deg.C to alleviate pinholes and strain due to thermally decomposed product produced in case of thermosetting.

Inventors

• 👤 Shunichi Fukuyama
• 👤 俊一 福山
• 👤 Yasuhiro Yoneda
• 👤 泰博 米田
• 👤 Masashi Miyagawa
• 👤 昌士 宮川
• 👤 Kota Nishii
• 👤 耕太 西井

Bibliographic Details