Semiconductor device

Abstract

Abstract PURPOSE:To improve the mounting density of a semiconductor device by interposing a salient electrode having good wettability, and connecting a semiconductor chip with leads in a connecting semiconductor chip. CONSTITUTION:The input/output terminals 6A of a connecting semiconductor chip 6 and the input/output terminal of a semiconductor chip 4 are electrically connected via a salient electrode 7 having good wettability, and the connector of the terminal 6B with the leads 5 is electrically connected via the electrode 7. Thus, since the salient electrode having good wettability is interposed and the chip and the leads are connected by the connecting semiconductor chip provided with wirings not possibly contacted at the adjacent position, the electric reliability of a semiconductor device can be improved.

Inventors

• 👤 Kazuo Tanaka
• 👤 一雄 田中
• 👤 Shuichi Nakagami
• 👤 中上　修一

Bibliographic Details