How to form multilayer wiring

Abstract

Abstract PURPOSE:To flatten multilayer interconnection easily by burying a contact hole with a polymer, giving the polymer high conductivity through ion implantation and conducting the lower layer wiring and the upper layer wiring in the multilayer interconnection consisting of a semiconductor. CONSTITUTION:A lower layer wiring 3 is formed onto an SiO2 insulating film 2 in a desired pattern, an inter-layer insulating film 4 is shaped, and the surface of the inter-layer insulating film 4 is flattened and treated. A contact hole 5 is bored, and spin-coated by using poly-P-phenylene, etc. A polymer layer 6 is shaped in the contact hole and on the insulating film at that time, a polymer on the inter-layer insulating film is removed through the etching of the whole surface, and the polymer is left only in the contact hole. Ions are implanted to the left polymer by employing AsF5, BF4 or I2, thus giving the polymer desired conductivity.

Inventors

• 👤 Masaki Yoshimaru
• 👤 正樹 吉丸

Bibliographic Details