Lead frame

Abstract

Abstract PURPOSE:To supply a good semiconductor device without the deformation of a lead wire to users preventing the deformation of the external lead wire and to improve the yield of mounting by fixing plural external lead wires sticking a heat-resisting tape to the external lead wires outside of a resin sealed region. CONSTITUTION:A heat-resisting tacky adhesion tape 7 (e.g., a polyimide series tape) is stuck on an external lead wire in the middle of a tie bar 3 and an external frame 4 and a semiconductor device is assembled. The semiconductor device which uses such a lead frame has little deformation since each external lead wire 5 is fixed by the tacky adhesion tape 7 even if stress (c) is given during stamping and selecting processes after cut from the external frame and the transportation to users so mounting is easy and a short-circuit due to the deformation of the external lead wire 5 is prevented.

Inventors

• 👤 Takehiro Saito
• 👤 斉藤　武博

Bibliographic Details