Resin-sealed semiconductor device and manufacture thereof

Abstract

Abstract PURPOSE:To seal completely the supporting plate of a resin-sealed semiconductor device by a method wherein the device is made in a structure, wherein the first sealing resin part covering the supporting plate, whereon a semiconductor chip is adhered, and the semiconductor chip excluding part of the supporting plate and the second sealing resin part covering the remaining part of the supporting plate are adhered to each other. CONSTITUTION:A silicon power transistor chip 23 is adhered on a supporting plate 21, and at the same time, external lead wires 22a-22c are formed. The supporting plate 21 is sealed with a sealing resin. The sealing resin consists of a first sealing resin part 36, with which the chip 23 and the supporting plate 21 are coated excluding part of the supporting plate 21, and a second sealing resin part 38, with which the remaining part of the supporting plate 21 is coated. The first and second sealing resin parts 36 and 38 are formed in such a way that the resin parts 36 and 38 are adhered to each other and the supporting plate 21 is completely sealed.

Inventors

• 👤 Takaaki Yokoyama
• 👤 隆昭 横山

Bibliographic Details