Spin coating device

Abstract

Abstract PURPOSE:To reduce the quantity of air which comes in contact with the surface of the material to be coated as well as to obtain the uniform thickness of coated film by a method wherein an air feeding unit with which clean air is supplied into a cover is provided, and an air stream is used as the means of removing the grains scattered by centrifugal force after coating. CONSTITUTION:A splash preventing plate 9, having the top point a little upward of the position of a wafer surface on the outer circumference of a wafer 1, is provided in order to prevent the scattering of the fluid and the solid-state grains of the liquid resist on the wall surface of a cover 6 from the outer circumference of the wafer 1. An air blowing-out hole 10 is provided on the splash preventing plate 9, and clean air sent from the air feeding unit 11 is blown out from the blow-out hole 10. The grains scattered in circumferential direction of the wafer 1 are removed from a coating device by the clean air sent from the blow-out hole 10. Also, as a little grains are generated on the upper part of the wafer surface by the diffusion and the like of the liquid resist, the grains on the upper part of the wafer surface can also be removed by blowing the clean air into the clean-air device from an intake hole 12 located above the cover 6.

Inventors

• 👤 Nobuaki Sato
• 👤 宣明 佐藤
• 👤 Toshiyoshi Iino
• 👤 飯野　利喜

Bibliographic Details