Bonding heater device

Abstract

Abstract PURPOSE:To unnecessitate a pressing device, to reduce thermal loss and to prevent the damage of a dies on the titled device by a method wherein the dies is positioned and fixed on the reference surface utilizing a vacuum sucking action. CONSTITUTION:Atmospheric gas Pa is heated up when it passes through a heat stage 23, it is exhausted from the blow-out hole 25 of a blow-out tube 24, a local atmospheric condition is formed in the vicinity of a dies 22, and it is jetted out from a blow-out hole 26 and an atmospheric condition is formed on the whole device. The dies 22 is placed on the heat stage 23, the pressure of the atmospheric gas Pa blowing out from the blow-out hole 25 located on the side face of the dies 22 is temporarily increased by controlling a flow-rate regulating valve 29, the dies is positioned by applying pressure, the vacuum atmosphere coming from a vacuum generating device 30 is introduced into a suction hole 27c, and the dies 22 is sucked and fixed to the reference surfaces S1 and S2. A chip 22a is placed on the dies 22, and it is bonded by heating the heat stage 23 using a heater 21. No heat loss is generated by a pressing device.

Inventors

• 👤 Hisashi Kato
• 👤 恒 加藤
• 👤 Hideo Ichimura
• 👤 英男 市村

Bibliographic Details