Semiconductor device

Abstract

Abstract PURPOSE:To prevent generation of cracks and exfoliation on a pellet by a method wherein the pellet is adhered to a substrate using an elastic material or a gel-formed bonding agent, thereby enabling to reduce the stress applied to the pellet even when the substrate is deformed. CONSTITUTION:A package base 2, consisting of glass epoxy resin and the like, and a pellet 1 are fixed using the elastic material or a gel-formed bonding agent such as silicon rubber or silicon gel, filler-contained silicon rubber or filler-contained silicon gel and the like. When the package base 2 which will be turned to a base is deformed by the temperature cycle and the heat of the heat treatment, stress is absorbed and lessened by a bonding agent 5, and the exfoliation of the pellet 1 from the package base 2 and the cracks generating on the pellet 1 can be prevented.

Inventors

• 👤 Takashi Miwa
• 👤 孝志 三輪
• 👤 Kanji Otsuka
• 👤 寛治 大塚
• 👤 Atsushi Honda
• 👤 厚 本多
• 👤 Masayuki Shirai
• 👤 優之 白井
• 👤 Yasuyuki Yamazaki
• 👤 康行 山崎
• 👤 Ken Okuya
• 👤 謙 奥谷

Bibliographic Details