Ic-chip cooling device

Abstract

Abstract PURPOSE:To enable to realize chip exchange easily in self-alignment manner by using a low melting point metal filling a recess formed at the bottom of a cooling block and flexible pipes having springy property. CONSTITUTION:Screws are removed from the titled device, and the whole device is heated, where the melting point of the metal of an adhesion layer 15 is chosen at the lowest temperature of those of brazing material and solder adhering various parts of the device. Thereby, a substrate 3 and a housing 6 can be separated from a cap 5 between a boundary plate 13 and the cooling block 14 without damaging the adhesion of other parts. When the whole device is re-heated after chip exchange, the metal of the adhesion layer re-fuses, and the boundray plate is fixed again to the block. In this case, the warp of the substrate and the variation in the height of solder terminals 4 are all absorbed by the adhesion layer and bellows 12. Besides, the wall around the recess at the bottom of the block does not allow the outflow of the low melting point metal 15 swelling around a chip-positioning guide and the boundary plate.

Inventors

• 👤 Keiichiro Nakanishi
• 👤 中西　敬一郎
• 👤 Minoru Yamada
• 👤 稔 山田
• 👤 Akira Masaki
• 👤 亮 正木
• 👤 Kuninori Imai
• 👤 今井　邦典
• 👤 Katsuaki Chiba
• 👤 千葉　勝昭

Bibliographic Details